G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current This Safety Guideline applies to

This Safety Guideline applies to atmospheric and vacuum wafer-handling robots that are manufactured with their supplier’s intention that they be integrated into semiconductor manufacturing equipment

本スタンダードは，global Flat Panel Display – Materials & Components Committeeで技術的に承認されている。現版は2011年7月1日，global Audits and Reviews Subcommitteeにて発行が承認された。2011年8月にwww

It stresses the impact of the IC and end product requirements

This Standard provides guidelines for both the process of developing and delivering equipment training that is performance-based

G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current This Safety Guideline applies toMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The